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FA30SB3-210

by Winmate
Price on request
Fanless Embedded System, NXP i.MX6 Dual-Core 1GHz SoC, 1GB LPDDR3 RAM, 16GB eMMC, MicroSD Slot, MicroHDMI, 1xCAN, 1xPoE LAN, 1xRS232, 1xUSB 2.0, 1xMicroUSB OTG, 1x8-bit DIO, 12VDC-in Terminal Block with PSU, -20..60C

Construction

Construction Chassis Aluminium Chassis
Mounting Configuration Desktop, Wall

CPU

Processor Installed NXP i.MX6 dual-core
Socket CPU onboard
Frequency 1 GHz

Chipset

Chipset SoC

Memory

Memory Type LPDDR3
Default on Board Memory 1 GB
Maximum Memory 2 GB
ECC No

Graphic

Graphic Controller Integrated in CPU

Network Adapter

Total Ethernet 1
PoE+ 10/100/1000 Mbit/s 1

Interfaces

COM Total 1
RS-232/422/485 1
USB Total 2
USB 2.0 1
Micro USB (OTG) 1

Digital Input-Output

Channels of DIO 8
Channels of DI 3
Channels of DO 3

Industrial Protocols

CAN Port 1

Storage

microSD Socket Yes
eMMC support Yes
eMMC memory size 16 GB

Additional Functions

Bluetooth Yes

Cooling

Type Fanless

Connectors / Cables

Connectors RJ45 Ethernet, DC input (terminal block), DB15 CAN Bus, 1xMicro USB, MicroSD card slot, Micro HDMI, USB type A

System Power Input

Input Voltage DC 12~12 V

Power Supply

Type of Power Supply External power adapter AC/DC
Output Power 50 W

Software

Operating System Compatibility Android, Linux kernel 4.x, Ubuntu 18.04 LTS, Linux Debian 7.7

Dimensions and weight

Width 224 mm
Height 47 mm
Depth 127 mm

Operating Conditions

Temperature -20~60 °C
Humidity 10~90 %

Standards and Certifications

Certifications CE/FCC